Thermal Management Solutions
Wide Range of Solutions for Top Performance
Exponential increases in thermal dissipation at the circuit level have prompted us to develop innovative thermal management solutions, such as conductive-cooled PCB’s traditionally fabricated with solid copper cores. Our quest for even higher performance led us to develop lighter weight materials using carbon fiber fabric with thermal conductivities ranging from 10 to >600 w/m*k,
Thermal Management
Viasystems’ thermal management solutions include our patented embedded E-Coin technology along with heat sink coin attachment capabilities and heavy copper. Our expertise in RF/Microwave is unmatched in the industry.
DESIGN ADVANTAGES OF VIASYSTEMS PFC TECHNOLOGY
- Localized solid copper sites for thermal management of high-energy components.
- Direct thermal path from component device to backside of printed circuit board.
- Integral part of the printed circuit board.
- Lead-free process compatible.
- Custom shapes to fit your component device.
- Press-Fit Coin Technology
Case Studies
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