Exponential increases in thermal dissipation at the circuit level have prompted us to develop innovative thermal management solutions, such as conductive-cooled PCB’s traditionally fabricated with solid copper cores. Our quest for even higher performance led us to develop lighter weight materials using carbon fiber fabric with thermal conductivities ranging from 10 to >600 w/m*k,
Viasystems’ thermal management solutions include our patented embedded E-Coin technology along with heat sink coin attachment capabilities and heavy copper. Our expertise in RF/Microwave is unmatched in the industry.
DESIGN ADVANTAGES OF VIASYSTEMS PFC TECHNOLOGY