Today’s circuits extend copper interconnects bandwidth by the GHz, making PCB signal integrity crucial to overall performance. We focus on this key aspect at every phase, from concept through production. We ensure this quality by selecting the correct circuit geometries and dialectric materials, verifying all circuit parameters for specific tolerance using specialized modeling software; and testing using TDRs for the most demanding applications.
The documents below discuss manufacturing techniques such as back drilling for stub removal, advanced thin film embedded capacitance, low dissipation factor materials and signal integrity modeling studies and methodology.