Viasystems applications based approach provides innovative engineering and advanced process capabilities.
From defense/aerospace electronics, medical devices and imaging, or complex telecommunications equipment, Viasystems supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low loss laminates and a total of over 70 resin systems.
Our Field Applications Engineering team provides a long history of collaborative engineering support. Qualifications include MIL-PRF-31032, MIL-PRF-55110, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP.
Our Capabilities Include: