Power Distribution

Increasing circuit densities and speeds are challenging traditional PCB power distribution techniques. Viasystems engineering teams have pioneered many techniques to address power delivery, including our ability to process copper up to five ounces; advanced planar buried capacitance materials providing 500 pf to 1500 pf per-square-inch in conjunction with extremely low sheet inductance; and laser and mechanical Via-In-Pad technologies for direct vertical connections without surface traces, providing the lowest possible inductance.

Contact Viasytems to learn more about our advanced processes.

• Power Delivery Network