PCB ROADMAP:
A Guide To Our Technological Capabilities And Processes
Viasystems is a proven technology leader in the field of printed
circuit boards (PCBs) and features an advanced technology offering
that includes:
- 50+ layers
- Back drilling
- Differential impedance
- Buried capacitance
- Blind and buried via
- Sweat soldering for coin-attachment
- High-speed materials, including Rogers, Getek, 4000-13, and more
- Heavy copper up to 12 ounces
- RoHS material ready
- Multiple surface finishes available for lead-free assembly
- Aluminum or copper heatsink
- Via in pad
- Large format backplanes (24” x 50”)
Viasystems’ PCB technology roadmap for capabilities and
processes is listed below:
| Layer Count |
42 |
50+ |
50+ |
| Max PNL / Circuit Size |
29" x 49" / 27" x 47" |
29" x 49" / 27" x 47" |
29" x 49" / 27" x 47" |
| Max Thickness |
0.400" |
0.400" |
0.400" |
| Min Dielectric |
0.0025" / 0.001" (BC) |
0.0025" / 0.001" (BC) |
0.0025" / 0.001" (BC) |
| Line / Space Ext. |
0.003" / 0.003" |
0.003" / 0.003" |
0.003" / 0.003" |
| Line / Space Int. |
0.003" / 0.003" |
0.003" / 0.003" |
0.003" / 0.003" |
| Min. Drill Dia |
0.010" *a |
0.008" *a |
0.008" *a |
| Laser Drill Dia |
0.004" *a |
0.003" *a |
0.003" *a |
| Max. PTH A/R |
14 : 1 *b(T=400mil) |
16 : 1 *b(T=400mil) |
16 : 1 *b(T=400mil) |
| Zo Tolerance ohms |
±10% |
±10% |
±10% |
| Back Drill |
Yes |
Yes |
Yes |
| ENIG |
Yes |
Yes |
Yes |
| OSP + Preflux (Lead Free OSP) |
Yes |
Yes |
Yes |
| Immersion Sn / Ag |
Yes |
Yes |
Yes |
| Soft Gold + Hard Gold |
Yes |
Yes |
Yes |
| Via Filling |
No |
Yes |
Yes |
| E-Spray Soldermask |
Yes |
Yes |
Yes |
| Lead Free Coin Attach |
No |
Yes |
Yes |
*a Aspect Ratio Limitation
*b Drill Hole Size Limitation
The Aspect Ratio and min. DHS may be different depending on the technology configuration.
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