PCB MATERIALS:
Solutions For High-Technology Applications
Viasystems’ printed circuit boards (PCBs) feature all
the major PCB materials solutions for standard, high technology,
and RF PCB applications. Please see the following for specific
materials by category and capability:
Viasystems Materials offerings for facilities in Guangzhou & Zhongshan Material categories / capability:
- FR4
- Dicy & Phenolic, filled and unfilled
- Hi-Speed / Low Loss
- PPO/FR4
- Modified FR4
- BT/FR4
- Ceramic filled Hydro-carbons
- Teflons and ceramic filled teflons
- Halogen Free
- Mid to Hi-Tg Availability
- Latest state of the art RoHS compliant
- Fillers
- N-ring
- P connect to backbone
RoHS & Viasystems:
- 100% RoHS compliant
- Laminated & Prepreg
- Soldermasks
- Legend inks
- Surface finishes
- Via fill
- RoHS assembly compatible with all material categories (ref
above)
- Some Dicys for (2L) or DSR
- Filled and unfilled Mid-Tg Phenolics for MLB
- Filled and unfilled Hi-Tg Phenolics for MLB
- Some Halogen Free - both Mid & Hi-Tg for DSR & MLB
CAF & Viasystems:
- Offer solutions for both DSR and MLB
- Detailed Dialogue between Customer & Viasystems Required
- Materials and Design Relevant
Full Underwriter Laboratories available for most materials.
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