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PCB MATERIALS:

Solutions For High-Technology Applications

Viasystems’ printed circuit boards (PCBs) feature all the major PCB materials solutions for standard, high technology, and RF PCB applications. Please see the following for specific materials by category and capability:

Materials

Viasystems Materials offerings for facilities in Guangzhou & Zhongshan Material categories / capability:

  • FR4
    • Dicy & Phenolic, filled and unfilled
  • Hi-Speed / Low Loss
    • PPO/FR4
    • Modified FR4
    • BT/FR4
    • Ceramic filled Hydro-carbons
    • Teflons and ceramic filled teflons
  • Halogen Free
    • Latest state of the art RoHS compliant
    • Fillers
    • N-ring
    • P connect to backbone

RoHS & Viasystems:

  • 100% RoHS compliant
    • Laminated & Prepregs
    • Soldermasks
    • Legend inks
    • Surface finishes
    • Via fill
  • RoHS assembly compatible with all material categories (ref above).
    • Filled and unfilled mid Tg
    • Filled and unfilled high Tg

Full Underwriter Laboratories available for most materials.