Viasystems developed and now offers third generation microvias or NextGen-SMV® which offers stacked microvia fabrication in a timely manner (5-7 days). NextGen-SMV® Technology allows for a quick-turn of PCB designs with complex via structures and requires only one lamination cycle reducing thermal excursions (thermal degrading of material) and cycle time.
NextGen-SMV® eliminates the copper plating cycle of inner layers, improving impedance tolerance, reducing overall thickness and improving electrical characteristics. Additionally, NextGen-SMV® provides designer flexibility to have any-layer-via connectivity using a metallurgical bond between conductive paste and copper on the inner layers. SMV® Technology can also be utilized with NextGen-SMV for the surface or external microvias to create a solid copper via if required.
Viasystems NextGen-SMV® provides Advanced Interconnect Solutions in a timely manner.