PCB TECHNOLOGY:

Midplanes and Backplanes

Viasystems’ vast experience in midplane and backplane technology through our former Western World PCB operations allows us to enhance our technical capabilities in Guangzhou, China to create one of the most technically advanced, largest-volume operations in the world. Here is a brief summary of our midplane and backplane capabilities.

MIDPLANES & BACKPLANES
	Layer count 50+
	Panel size capability up to 26" x 49"
	Maximum Thickness 0.400", 10mm
	Aspect Ratio 14:1
	Impedance Control single & differential lines
	Blind vias / depth controlled drilled
	Backdrilling multiple depths from both sides
	Standard FR4 to low loss material and hybrids