PCB TECHNOLOGY:
Midplanes and Backplanes
Viasystems’ vast experience in midplane and backplane
technology through our former Western World PCB operations allows
us to enhance our technical capabilities in Guangzhou, China
to create one of the most technically advanced, largest-volume
operations in the world. Here is a brief summary of our midplane
and backplane capabilities.
 |
Layer count 50+ |
| Panel size capability up to 29" x 49" |
| Maximum Thickness 0.400", 10mm |
| Aspect Ratio 14:1 |
| Impedance Control single & differential lines |
| Blind vias / depth controlled drilled |
| Backdrilling multiple depths from both sides |
| Standard FR4 to low loss material and hybrids |
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