Midplanes & Backplanes
Industry-Leading Capability
Viasystems has extensive experience in midplane and backplane technology. We are one of the world’s most technically advanced and largest-volume backplane providers in the world.
Viasystems operates from three dedicated E-MS location. These technologically advanced facilities offer extensive experience with large panel sizes, high aspect ratios, high layer count s, among others.
Here is a brief summary of our midplane and backplane capabilities.
Midplanes and Backplanes
- Layer count: up to 60
- Panel size capability: 28" x 49"
- Maximum Thickness: 0.365" nominal (9.125 mm)
- Aspect Ratio: 16:1
- Impedance Control single and differential lines
- Blind vias / depth controlled drilled
- Backdrilling multiple depths from both sides
- Standard FR4 to low-loss material and hybrids
Case Studies
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