PCB TECHNOLOGY:
Microwave & Heatsink Technology
Viasystems has developed technology to support RF applications.
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Volume PTFE processing capability |
| Hybrid construction with PTFE / FR4 and RO4350B/FR4 |
| Heatsink applications using high temperature coin attach as well as pre-bonded heatsink capability |
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Aluminum heat-sinks bonded using pressure adhesive isolating film |
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