PCB TECHNOLOGY:
High Density Interconnect
Viasystems supports High Density Interconnect technologies
and has used laser processing for Microvia formation
for a number of years with great sucess. The following
solutions are offered by Viasystems.
 |
Putting the via in the BGA pad creates space
on the external layers for more routing and avoids potential shorts
during assembly. The routing channel width on the
internal layers will not change. |
 |
If VIP is not prefered the build can be
made sequential with buried vias (filled with epoxy
material) as shown in the cross-sections. Microvias
can be stacked on top of the Buried via to create
space on the external layers. |
 |
Min micro-via diameter |
4mil |
| Max aspect ratio |
.75 : 1 |
Microviastructure type I -
1[C]0 or 1[C]1 |
Mass Production |
| Microviastructure type II - 1[C]0 or 1[C]1 |
Mass Production |
| Microviastructure type III- =2[C]=0 |
Mass Production |
| Throwing Power |
85% |
 |
|
|
 |
|
