PCB TECHNOLOGY:
Heavy Copper
Viasystems has developed heavy copper technology to support
high-power applications.
| Layer Count |
4L (12oz), 6L (10oz) |
| Max Panel Size |
18" x 24" |
| Max Thickness |
0.160" |
| Min Dielectric |
0.009" (Prepreg) |
| Min Drill Dia |
0.024" |
| Wet film registration |
±2 mil |
| Max. A/R |
10 : 1 |
| Depth Control Drill |
Yes |
 |
Number of Layers |
4L |
| Panel Thickness |
160 mil |
| Aspect Ratio |
10:1 |
| Panel Size |
21x16 |
| Etch Factor (w) |
6.6 - 7.2 mil |
| Line Width |
40 mil |
|
