Viasystems is a leading supplier of complex PCBs, backplanes and assemblies, racks, subracks and indoor/outdoor enclosures to major OEM customers in the telecommunications industry.
Viasystems has a long history serving the telecommunications market and we understand the stringent requirements of our customers in terms of speed/time to market, product reliability, quality, and total cost of ownership. Our roots trace back to highly complex electromechanical assemblies for the telecommunications infrastructure market. Today, Viasystems continues that heritage with quick-turn (QTA) and volume PCB production in the U.S. coupled with low-cost, QTA and high-volume PCB manufacturing capabilities in China.
We fabricate low- to high-layer-count printed circuit boards and backplanes, including large format/oversized panels and high aspect ratio plating, where we understand the importance of signal integrity and impedance control requirements. We offer world-class material and processing expertise in RF & microwave applications, including mixed material constructions, blind and buried via structures and cavity designs which are key competencies our customers rely upon.
We are a recognized innovator in Thermal Management Solutions (TMS), and we support adhesive, sweat solder and press-fit coin attach solutions. We also support Embedded Coin Solutions, including our patent-pending E-Coin embedded copper technology and thick copper capabilities enable our customers to better design and manage applications involving high power transistors in their products.
We have broad capabilities to provide enclosures (indoor and outdoor), backplane assembly, bus bars, and full system integration and test. It’s our vertical “under one roof” model in low cost regions such as China and Mexico that allows Viasystems to provide not only best-in-class pricing but also world-class manufacturing, logistics and supply chain solutions to customers across the globe. Our engineering design support teams help our customers streamline and cost-reduce their products and facilitate fast turnaround of new product introductions (NPI), meeting our customers’ ever-important time-to-market requirements.
Our key telecommunications global manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality at a competitive cost. With an impressive list of blue-chip customers, Viasystems stands ready to support our customers’ total needs in delivering world-class, high-technology solutions to telecommunications customers globally.