Core Competency

• High Mix, Low Volume, HDI 24 hr to 72 hr Quick Turn
• Expertise in High Technology QTA
• Type 1, 2, 3 HDI; Via-Fill
• Cu Filled/Epoxy Filled Stacked Micro-vias
• High Performance Materials

Certifications

• ISO 9001:2008
• ISO 14001:2004 Compliant
• Mil-PRF-31032 GI
• Mil-PRF-31032
• Mil-PRF-55110
• Mil-PRF-55110G
• ITAR Registration
• Bellcore Compliant

Key Data

• Square Feet: 40,000 sq. ft.
• Maximum Panel Size: 18" X 24"
• Maximum Board Thickness: .230"
• Aspect Ratio: 12:1
• Layer Count: 30+
• Tracks & Gaps: 3/3
• Minimum Core Thickness: 2.5 mil
• Buried Capacitance: 0.5 mil
• Blind and Buried Vias
• Laser Micro Vias
• Back Drilling
• Edge Plating
• Controlled Impedance and Differential Impedance
• Via filling
• Multiple Finishes