Core Competency

• ATE and BIB product specialists (Semiconductors)
• Telecom and medical applications
• High end computing
• Mixed material construction
• New Product Development
• DFM Analysis
• Product Engineering
• Process Engineering
• Quality Engineering
• Failure Analysis

Certifications

• ISO 9001:2008
• AS9100C
• NADCAP
• ITAR
• MIL-PRF-31032
• MIL-PRF-55110

Key Data

• 62K square feet
• Up to 60 layers
• 0.012” - 0.250” thick
• Blind & Buried Vias
• Buried Capacitance
• Sequential Lamination
• 0.004” Micro Vias
• O/L LWS 0.002” / 0.003”
• Thick Backpanels
• I/L LWS 0.002”/ 0.002”
• Thick Copper Layers
• Mixed Material Constructions
• Optical drilling/Routing