Viasystems

Forest Grove

Viasystems Forest Grove
1521 Poplar Lane
Forest Grove, Oregon 97116
United States
Tel: (503) 359-9300
Fax: (503) 357-1504

Core Competency

  • Prototype & Production HDI Low/Medium Volume Fabrication
  • Expertise in High Technology QTA (5-10 days)
  • Type 1, 2, 3 HDI; Via-Fill
  • Cu Filled/Epoxy Filled Stacked Micro-vias
  • High Performance Materials
  • Thermal Management Solutions (i.e. Cavity, Coin Attach, Press-fit)

Certifications

  • ISO 9001:2008
  • AS9100C
  • Nadcap
  • ISO 14001:2004
  • Mil-PRF-31032 GI
  • Mil-PRF-31032
  • Mil-PRF-55110
  • Mil-PRF-55110G
  • ITAR Registration
  • Bellcore Compliant

Key Data

  • Square feet: 269,000
  • Maximum Panel Size: 24" x 28"
  • Maximum Board Thickness: .275"
  • Aspect Ratio: 16:1
  • Layer Count: 40+
  • Tracks & Gaps: 3mil/3mil
  • Minimum Core Thickness: 2.5 mil
  • Buried Capacitance – min. 0.5 mil
  • Blind and Buried Vias
  • Laser Micro Vias
  • Back Drilling
  • Edge Plating
  • Controlled Impedance and Differential Impedance
  • Coin and Pallet Attachment
  • Via filling
  • Multiple Finishes