Core Competency

• Front end process development
• Advanced HDI Technology
• Experimental designs and applications
• High Technology Prototype and Pre-Production
• Hybrid Constructions
• Innovative Technology

Certifications

• ISO 9001:2008
• AS9100C
• NADCAP
• ITAR
• MIL-PRF-31032
• MIL-PRF-55110

Key Data

• 90K sq ft facility
• Up to 40 layer
• 0.005” - 0.325” thick
• Blind & Buried Vias
• FLAT-WRAP™ Technology, NextGen-SMV®
• Sequential Lamination
• 0.004” Micro Vias
• O/L L&S 0.003”/0.003”
• Stacked Microvias®
• I/L L&S 0.0025”/0.0025”
• LDI imaging
• Hybrid Constructions
• Embedded Resistors / Capacitance
• Conductive Via Fill
• LPI Legend
• Thin Core Processing
• Flat pad (via in pad)
• Cavity
• Edge Castellation