Core Competency

• High-volume Multi-layer Printed Circuit Boards
• HOI
• Oversize Backpanel Technology

Certifications

• ISO 9001:2000
• ISO 14001:2004
• UL796
• ISO/IEC 17025
• TL 9000
• ISO/TS 16949:2002
• Bellcore Compliant

Key Data

• 2,356,000 square feet
• Maximum Panel Size: 26” x 49”
• Maximum Board Thickness: 400 mil
• Aspect Ratio: 18:1
• Layer Count: 60+
• Tracks & Gaps: 3/4 (External) & 3/3 (Internal)
• Minimum Core Thickness: 1 mil
• Blind and Buried Vias
• Laser Micro Vias
• Back Drilling
• Buried Capacitance
• Edge Plating
• Controlled Impedance and Differential Impedance
• Coin Attachment
• Via filling
• Multiple Finishes