Viasystems has developed an innovative group of vertically integrated Electro-Mechanical Solutions. These capabilities begin with design and prototyping services within the production operations that smoothly transition to full electro-mechanical system manufacturing.
Our vertical capabilities also include sheet metal fabrication, backplane assembly, system integration, cable assembly, bus bar manufacture, full systems test and logistics for a complete solution supporting sub-system and full system integration requirements. In addition, our solutions are enhanced through Viasystems’ global supply chain and support services that are focused on optimizing flexibility and cost containment across all operations.
Viasystems’ E-M Solutions leverage our vertical model, under-one-roof capabilities in cost effective regions. We provide the highest levels of technology and technical support while operating as a global enterprise from the standpoints of engineering, supply chain, program management and manufacturing operations. Viasystems supports the entire life cycle of a product from design to design for manufacturing efficiency to prototyping to cost effective, high-volume production.
Viasystems’ electro-mechanical integration solutions include all the “mission- critical” building block components that support our customers’ products and requirements. These system components include the following:
Viasystems produces a range of rack, sub-rack and chassis systems to house revenue-generating products. Precision sheet metal sub-rack and chassis systems mount into standard 19” or 23” indoor racks or integrate into standard or custom indoor or outdoor enclosures. Viasystems has experience in designing to global rack standards including EIA-310-D, GR-63-CORE and IEC 297.
Fan tray systems are integrated into chassis systems and/or outdoor enclosures to ensure the correct thermal management of revenue-generating equipment.
Viasystems offers custom bus bar products, bar stock bending and punch, water-jet cutting from sheets. Markets served include industrial, energy, telecom, and computer/datacom. All raw materials comply with ASTM B187 and B152 standards (China standard GB/T 2529-2005). Tin-plating or silver plating comply with ASTM B487.
Viasystems’ engineering can model your thermal requirements and help select a thermal management solution that works. Heat exchanger choices include sealed cross-flow or counter-flow heat exchanger and natural or forced ventilated with or without filters. Our heat exchangers meet all relevant requirements of ETSI 300 019-2-4 and GR-487 for computer/datacom and telecom applications.
Let Viasystems demonstrate the value of Vertical Advantage which includes integration of printed circuit boards, backplanes, chassis/rack systems, power distribution and fan assemblies all fully integrated, tested and shipped to end markets around the globe.