Viasystems provides a complete solution for backplane (backpanel) fabrication and assembly from our cost competitive manufacturing facilities in both North America and China.
Viasystems builds all sizes and types of backplanes, including some of the largest and most sophisticated backpanels in the world. We possess the equipment and the advanced technology for the following features:
Viasystems has set up significant capabilities in cost effective region facilities supporting our customers’ global requirements. We offer both leaded and lead-free processes, to assemble components onto a printed circuit backplane board. Components include active and passive devices, thru-hole (soldered) components, press fit (compliant) components, and a variety of mounting hardware. Full test and AOI capabilities insure the highest quality delivered products.