header

BACKPLANE FABRICATION & ASSEMBLY:

High Quality, Low Cost

Viasystems provides a complete solution for backplane fabrication and assembly from our low-cost manufacturing facilities.

Backplane Fabrication

Viasystems has transferred extensive knowledge and equipment from our former factories in the western world to our China operations. We now have capabilities and are in production on advanced technology backplanes including the following features:

  • Layer count 50+
  • Panel size capability up to 50"x24", 1270x610mm.
  • Maximum Thickness 0.400”, 10mm
  • Aspect Ratio 15:1
  • Impedance control single and differential lines
  • Blind vias/depth controlled drilling
  • Backdrilling multiple depths from sides
  • Standard FR4 to low loss material and hybrids

Backplane Assembly

Viasystems has set up significant capabilities in our low-cost region facilities supporting our customer requirements. We offer a wide range of capabilities, including both leaded and lead free processes, to assemble components onto a printed circuit backplane board. Components include active and passive SMT devices, thru-hole (soldered) components, press fit (complaint) components, and a variety of mounting hardware. Full test and AOI capabilities insure the highest quality delivered products.