BACKPLANE ASSEMBLY
For backplane assembly, Viasystems has set up significant capabilities
in our low cost region facilities supporting our customer requirements.
We offer a wide range of capabilities, including both leaded
and lead free processes, to assemble components onto a printed
circuit backplane board. Components include active and passive
SMT devices, thru-hole (soldered) components, press fit (complaint)
components, and a variety of mounting hardware. Full test and
AOI capabilities insure the highest quality delivered products.
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Key Equipment Utilized |
Automatic Pin Insertion |
| Automatic Connector Insertion |
| Reflow Ovens (RoHS capable) |
| Waver Soldering (RoHS capable) |
| Automatic Optical Inspection |
| Large Format SMT Line |
| Hi Pot Testing |
| RF Testing |
| EEPROM Programming |
| Types of Components Installed |
Compliant & SMT Connectors |
| Standard Connectors - Metral/DIN |
| All High Density Connectors |
| Active SMT Components |
| Passive SMT Components |
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