Viasystems Group, Inc., headquartered in St. Louis, Missouri, is a leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs. Viasystems has the ability globally to support the customer’s full product life cycle from quick-turnaround PCBs for new product introduction to mid and high-volume, cost effective fabrication of complex boards – combined with comprehensive sourcing, assembly, and metal fabrication capabilities to supply everything from subassemblies to finished electronic products.
We provide advanced-technology printed circuit boards, large format backplanes and assemblies, custom sheet metal and enclosures, cabinets, racks and subracks, and electro-mechanical assemblies all the way through Level 5 Integration. Industry leaders in automotive technology, telecommunications, computer storage systems, and industrial, medical and aerospace equipment trust Viasystems to provide the technology, quality and service they require. Our technical support centers around the globe provide local engineering support and assist customers in launching new products.
|Printed Circuit Boards||Electro-Mechanical Solutions|
|Description||Represents approximately 85% of revenue||Represents approximately 15% of revenue|
|Serves automotive, telecom, computer/datacom, Industrial & Instrumentation / medical/consumer, and military/aerospace markets||Serves automotive telecom, computer/datacom, Industrial & Instrumentation / medical/consumer, and military/aerospace markets|
|Manufactures printed circuit boards and backplanes (backpanels)||Fabricates custom and standard metal cabinets and components|
|Assembles and tests finished systems|
|Competitive Difference||Leading technology globally||Vertical model “under one roof” is cost-effective for customers|
|Volume manufacturing in China and North America||Two E-M Solutions centers in China and one in Mexico with vertical model|
|Quick-turn capability in the United States and China||Full design support, Design for Manufacturing|
|Unparalleled combination of global technology centers and high volume manufacturing footprint in cost competitive regions.||Expertise in global supply-chain management|